Cina Elektronik 10 Lapisan Cepat Putar Prototipe PCB Fabrikasi HASL OSP

Elektronik 10 Lapisan Cepat Putar Prototipe PCB Fabrikasi HASL OSP

Lapisan: 1-24lapisan, 1-28 L
Ketebalan Tembaga: 1oz, 0,25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz
Finishing permukaan: HASL, ENIG, OSP, Immersion gold, HASL Bebas Timbal
Cina IATF TS16949 Prototipe Pcb Manufacturing FR4 Hight TG Electronic Pcba

IATF TS16949 Prototipe Pcb Manufacturing FR4 Hight TG Electronic Pcba

Bahan: FR4, FR4 CEM1 CEM3 Tinggi TG
Lapisan: 1-24lapisan, 1-28 L
Ketebalan Tembaga: 1oz, 0,25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz
Cina One Stop 2oz Tembaga Quick Turn Prototipe PCB Immersion Gold

One Stop 2oz Tembaga Quick Turn Prototipe PCB Immersion Gold

Bahan: FR4, FR4 CEM1 CEM3 Tinggi TG
Lapisan: 1-24lapisan, 1-28 L
Ketebalan Tembaga: 1oz, 0,25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz
Cina Perangkat Medis Desain Perakitan Pcb CEM1 CEM3 Fabrikasi Pcb Multilayer

Perangkat Medis Desain Perakitan Pcb CEM1 CEM3 Fabrikasi Pcb Multilayer

Bahan: FR4, FR4 CEM1 CEM3 Tinggi TG
Lapisan: 1-24lapisan, 1-28 L
Ketebalan Tembaga: 1oz, 0,25 Oz -12 Oz, 1/2OZ 1OZ 2OZ 3OZ, 1-4oz, 3oz
Cina Immersion Gold Quick Turn Prototipe PCB 2oz Copper Clad Board Hight TG

Immersion Gold Quick Turn Prototipe PCB 2oz Copper Clad Board Hight TG

Bahan: FR4 CEM1 CEM3 Tinggi TG
Lapisan: 1-24lapisan, 1-28 L
Ketebalan Tembaga: 1oz, 0,25 Oz -12 Oz, 1-4oz, 3oz,dll.
Cina Quick Turn Hight TG PCB Prototipe 2oz Copper Clad Board Immersion Gold

Quick Turn Hight TG PCB Prototipe 2oz Copper Clad Board Immersion Gold

Material: FR4 CEM1 CEM3 Hight TG
Lapisan: 1-24lapisan, 1-28 L
Copper thickness: 1oz, 0.25 Oz -12 Oz, 1-4oz, 3oz
Cina Hight TG Quick Turn Prototipe PCB Immersion Gold 2oz Copper Clad Board

Hight TG Quick Turn Prototipe PCB Immersion Gold 2oz Copper Clad Board

Material: FR4 CEM1 CEM3 Hight TG
Lapisan: 1-24lapisan, 1-28 L
Copper thickness: 1oz, 0.25 Oz -12 Oz, 1-4oz, 3oz
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